High Rigid Body Design：
Higher workpiece machining accuracy. More stabilized bonding range. Higher accuracy.
Smooth Bonding Process：
The bonding process has been carefully designed in providing safe interlocking and higher yield rate.
Automatic Film Stripping Mechanism (Optional)：
Automatic bonding film stripping mechanism in providing stabilized action and higher efficiency.
Patented Bonding Mechanism：
Special bonding mechanism is designed to achieve higher bonding accuracy and air bubble free effect.
Bonding works for touch panel, LCD and notebook, etc.
|Dimensions of Machine L x W x H (mm)||W2296mm x L1720mm x H2296mm|
|Working Area L x W (mm)||500mm x 450mm|
|Bonding Accuracy||+/-0.05mm(standard model) CCD(optional)|
|Bonding Efficiency||1 pcs/5 sec (standard mode)|
|Motor (HP)||220V 50Hz 3P|
|Air Pressure Requirement||0.5MPa|
|Weight of Main Unit||1500kg|